POLYSET™ 9000 is a solid high molecular weight bismaleimide resin. At ambient temperature, POLYSET™ 9000 behaves like a thermoplastic. However, at temperatures in excess of 100° C (in the presence of a suitable free radical catalyst) thermoset cure occurs. POLYSET™ 9000 exhibits excellent low shrinkage properties, high hydrolytic stability, and high thermal stability (TGA decomposition onset is greater than 400° C).
POLYSET™ 9000 is recommended for adhesive applications and can be used as an additive to promote adhesion to difficult substrates such as polyolefins, ceramics, aluminum, and other metals. POLYSET™ 9000 is incompatible with ketones. It can be dissolved in aromatic solvents and, under heat (80° C), it will dissolve into reactive diluents such as isobornyl methacrylate. |
Manufacturer of Premium Specialty Resins
