POLYSET 9000-75T™ is a high molecular weight bismaleimide resin diluted with toluene for ease of handling and incorporation. At ambient temperature, POLYSET 9000-75T™ behaves like a thermoplastic. However, at temperatures in excess of 100° C (in the presence of a suitable free radical catalyst) thermoset cure occurs. POLYSET 9000-75T™ exhibits excellent low shrinkage properties, high hydrolytic stability, and high thermal stability (TGA decomposition onset is greater than 400° C).
POLYSET 9000-75T™ is recommended for adhesive applications and can be used as an additive to promote adhesion to difficult substrates such as polyolefin, ceramics, aluminum, and other metals. POLYSET 9000-75T™ is incompatible with ketones. It can be further diluted with aromatic solvents. |